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  1. Products and Technology
  2. Die Attach
  3. Soft Solder Die Bonding

Products and Technology

Acoustic Microscope
Bondtester
Cleaning System
Laser Tool
Snap Cure Oven
Sputtering & Coating
X-ray Inspection System
Die Attach
Die Bonding Flip Chip Multi Module Attach Soft Solder Die Bonding
Lithography
Imprint Lithography Mask Aligner Projection Scanner
Packaging
Molding Trim & Form

Micro-Power (H.K.) Semiconductor Limited

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Location and Contacts

Unit L, 14/F., Yue Cheung Centre,
1-3 Wong Chuk Yeung Street, Fotan,
N.T., Hong Kong.
Tel : 852-2632-7784
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