2. Besi
  3. Die Attach
  4. Soft Solder Die Bonding

Soft Solder Die Bonding 

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Esec Die Bonder 2009 SSIE ensures your leading market position.
The 2009 SSIE is the only softsolder bonder in the market able to handle 300mm / 12" wafers (optional).

Key Features:
• Highest Speed
• Best Process Quality
• Widest Application Range
• Fastest Time to Yield
• Co-Development
• Ready for the Future

Esec 2009 SSIE

Esec-2009-SSI-E

Product Details:

Specifications:
• Net productivity : 2,500 to 8,000 UPH typical
• Typical bonding accuracy (product dependent) : 60µm @ 3σ, with optical bond centering option: 50µm @ 3σ
• Solder wire spools:  

Diameter: max. 155 mm / 6.1”
Width: max. 12 mm / 0.47”
Mounting hole: 8 mm to 10.5 mm / 0.31” to 0.41”
• Wafer size Up to 8", 12" optional
• Die size : 1 x 1 mm to 11 x 11 mm, 
                  40 x 40 mils to 430 x 430 mils