2. Htc 

Snap Cure Oven 

Key Features:
• Fully automatic curing system for fast-cure glue.
• Easy to connect with kinds of Die-Bonder machine.
• Sutable for different type of packaging without change kits.
• Dual language(Chinese/English) operation interface and Windows based om MMI, easy to operation.

SC 904

HTC-SC904

• Die-Bonding and curing process in-line purpose.
• Die-Bonding process of package Stacking Dies
• Pre-Heating/Pre-Heating of Flip-Chip Under-Fill process.

Product Details:

Specifications:
• Substrate :120~260(W)x 45~90(D)mm
• Throughput : 720 ea/hour (Curing Time 3sec + Index Time)
• Heating : PID Control Curing Stations
•Transfer : Wire / Strip Indexer
• Magazine : Max. 270(W)x 90(D)x 160(H)mm