Sputtering & Coating 

Key Features:
Substrates
• Dimension: 16" x 20" ; 20" x 20" ; 20" x 24“
Coating Materials
• Ti, Cu, Ni, Ag, Cr…,etc.
Degas Module
• Up to 250 °C inside of vacuum chamber
Plasma Clean Module
• Surface cleaning & activation
• Plasma etching (Desmear / Descum )
Sputter Module
• Up to 9 planar magnetrons
• Low-temperature process
• Deposition uniformity:: Within carrier effective area < ± 5%; Carrier-to-carrier: < ± 3%
• SECS-GEM option
• Pick-n-Place option

MUSCA Family-In line Sputter

MUSCA

• NPL process of BGA substrate
• RDL process of FOWLP
• Fine line/space or embedded substrate
• Coreless substrate