The Esec 2100 sD^plus, the 2^nd generation of the proven Die Bonding Family, offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Further redefining Stacked Die Bonding. For your benefit.

Key Features:
• 12 µm Accuracy @ 3 Sigma (film based applications in High Accuracy Mode)
• Widest Application Range
• Shortest Time to Yield
• Highest Up Time
• Platform of the Future

Esec 2100 sD^plus

Model No.

Specifications:
• Bonding method : Epoxy and DAF
• Cycle time : 265ms
• Bonding accuracy : Down to 12 µm @ 3σ
• Wafer size : 4" to 12" (on 8" or 12" wafer frames)
• Die size : 0.25 mm (with Small Die Kit) to 20 mm
• Strip dimensions Length: 90 mm to 300 mm, Width: 20 mm to 125 mm