The Die Bonder Esec 2100 xPplus is the the 2nd generation of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.
Key Features:
• Leading Edge Machine Concept
• Highest Up Time
• Highest Speed at 15 µm Accuracy
• Fastest Time to Yield
• The Platform of the Future
