2. Besi
  3. Die Attach
  4. Flip Chip

Flip Chip 

As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today.
• Highest UPH up to 9000, including dip fluxing
• Full process and yield control
• Proven 5µm accuracy

Key Features:
• Unprecedented Speed
• Full Yield Control
• Proven production Accuracy
• Shortest Lead time

Datacon 8800 FC QUANTUM advanced

Datacon-8800-FC-QUANTUM-advanced

Product Details:

Specifications:
• X/Y placement accuracy : ± 5 µm @ 3 sigma
• Bond force : 200g - 5,000g
• Die size : 0.4 mm – 30 mm (Fast CUC mode <12 mm only)
• Die thickness : 0.02 mm – 7 mm
• Wafer size : 4" – 12" (on 8" or 12" wafer frames)
• Substrate types : FR4, ceramic, BGA, strip, flex, boat, leadframe
• Working range : 13" x 12"
• Flux film thickness : Various cavity plates available