Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders – an aggressive approach to driving down the cost of flip chip technology.
Key Features:
• Highest UPH – No Time Wasted
• Load & Run – Shortest Time to Yield
• Highest Up Time – Consistent Quality
• 2100 Platform Synergies – Reduced Operating Cost
Esec 2100 FC plus
Esec-2100-FC-plus
Specifications:
• Bonding method : Flip Chip
• Bonding accuracy : Down to 10 μm (3σ)
• Min. cycle time : 400 ms
• Wafer size : 4” to 12”
• Frame size: 6", 8” and 12”
• Die size : 0.5 … 20 mm / 20 mils … 0.8 inch
• Die thickness : ≥ 0.1 mm / ≥ 4mils (thinner on request)
• Strip dimensions : Length up to 500 mm, Width up to 125 mm (flat boats up to 137 mm)
