The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership
Key Features:
Datacon 2200 evo goes hS!
Enhancements
• PLUS Accuracy
• PLUS Productivity
• PLUS Flexibility
• PLUS UPH
• Multi-Chip Capability
• Flexibility for Customizing
• Open Platform Architecture
Datacon 2200 evohS
Datacon-2200-evo-hS
Specifications:
Performance
• X/Y placement accuracy: ± 7 µm @ 3σ
• Theta placement accuracy: ± 0.15° @ 3σ
Bond Heads
• Standard bond head 0° - 360° rotation
• Heated bond head (optional)
UPH
• up to 12000
