The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership
Key Features:
Datacon 2200 evo goes hS!
Enhancements
• PLUS Accuracy
• PLUS Productivity
• PLUS Flexibility
• PLUS UPH
• Multi-Chip Capability
• Flexibility for Customizing
• Open Platform Architecture