The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Key Features:Datacon 2200 evo goes PLUS!Enhancements• PLUS Accuracy• PLUS Productivity• PLUS Flexibility• Multi-Chip Capability• Flexibility for Customizing• Open Platform Architecture
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