The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity.
Key Features:
• Highest Productivity
• Extended Application Range
• Fastest Time to Yield
• Low Operating Costs
Esec 2009 fSE
Esec-2009-fS-E
Specifications:
• Net productivity: 2,500 to 8,000 UPH typical
• Temperature control : 8 zones, up to 450°, ±5°C
• Wafer size: up to 8”
• Frame size: 6”, 8”
• Die size: 0.4 x 0.4 mm - 11 x 11 mm / 16 x 16 mils - 430 x 430 mils
• Substrates and Carriers : Max length: 285 mm, Max width: 60 mm
• Die Placement Accuracy : ± 80 μm / 0.6° (3σ)
