Key Features:
• Spin-coat unit
• UV-lighting unit
• Electronic controller cabinet
• Tank cabinet
• Automatic cleaning of piping
• Graphical User Interface
• Programmable process parameters
• Terminal for EMO
• Chucks for different processes and wafer from 6''~12'', available from 100μm up to 700μm

HSC-300FA

Model No.

Specifications:
• Speed: 1 up to 6,000 rpm in 1 rpm steps (depends on substrate weight and size)
• Spinning time 0.1 up to 999sec in 0.1 sec steps
• Wafer size up to φ300