Key Features:
• Spin-coat unit
• UV-lighting unit
• Electronic controller cabinet
• Tank cabinet
• Automatic cleaning of piping
• Graphical User Interface
• Programmable process parameters
• Terminal for EMO
• Chucks for different processes and wafer from 6''~12'', available from 100μm up to 700μm
HSC-300FA
Hirata-HSC-300FA
Full-auto liquid DAF coating system
Specifications:
• Speed: 1 up to 6,000 rpm in 1 rpm steps (depends on substrate weight and size)
• Spinning time 0.1 up to 999sec in 0.1 sec steps
• Wafer size up to φ300