Key Features:
Package Configurations
• Package Type: SiP, BGA, QFN, LGA…,etc.
• Package Size: 2 x 2mm ~ 30 x 30mm (typical)
• Material: EMC, PCB, Organic substrates.
Carrier
• Dimension: 610 mm x 700 mm
Coating Materials
• Ti, Cu, Ni, SUS, Ag, Cr, magnetic material…,etc.
Degas Module
• Single/Multi-loop temperature control
• Up to 250℃inside of vacuum chamber
Plasma Clean Module
• RF plasma
• Surface cleaning & activation
• Multi step, process gas Ar, N2, O2, H2…,etc.
Sputter Module
• Up to 9 magnetrons
• Low-temperature process by passive/active cooling
• Dynamic and synchronous sputtering
• Deposition uniformity: Within carrier effective area < ± 5%; Carrier-to-carrier: < ± 3%
• SECS-GEM option
• Pick-n-Place option
