NEMS Plasma 

Key Features:
• Apply to in-line process
• Multiple gases (Ar, N2, O2, H2, mixed gas) can be used
• Physical, chemical or physical / chemical mode cleaning
• Very high cleaning efficiency
• Extremely high cleaning uniformity
• Very little gas consumption

In-line Plasma


For IC, LED, PCB Assembly, LCD

• In-line cleaning process
• Advanced flow pattern design
• High-speed plasma cleaning: 30~90 seconds / cycle, including loading / unloading, plasma treatment
• Low temperature plasma cleaning
• Chamber capability: 2~4 strips of substrate or lead-frames in one cycle
• High automation and operation friendly design