Bondtester 

Key Features:

  •  Wire Pull
  •  Tweezer Pull/Peel
  •  Ball Shear, Solder Ball Shear and Die Shear dependent on the system configuration. Each of the eight standard test heads incorporate four default software selectable operating ranges, with a further six available on request.
  •  Additional options include Cold Bump Pull, Vectored Pull for micro BGA, and automatic testing for small geometry packages
  • Internal SPC software to provide basic analysis
  • Fully ODBC compatible to exchange data with external Statistical Process Control systems. 
  • System control is provided through an external PC running Windows.

4000 Multipurpose Bondtester

DAGE-4000

The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull tester or upgraded for ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.