DSC300 GEN2
DSC300-Gen2
Projection scanner for 200 / 300 mm wafers
Process flexibility:
• Bridge tool, supporting 200 and 300mm wafers
• Broadband catadioptric projection optics
• 3µm resolution with high DOF and variable NA
• Sidewall angle optimization
Production Capability:
• Fully automated lithography platform
• Automated mask handling and library system
• Factory automation
Low cost of ownership:
• Cost efficient projection lithography system
• High throughput full-field imaging
• High yield
