Key Features:
• Top / bottom side / infrared alignment
• Accurate and precise gap setting for higher yield
• High-quality, diffraction reduction exposure optics for high resolution
• Optimum edge quality with thick resist
• Reliable sub-micron printing
• Processing of fragile wafers and pieces
• High intensity light sources reduce process time
• High accuracy fixture and fixtureless bond alignment option
• Aligned cold embossing option for full wafer printing of geometries in nanometer range
• Near Field Holography option for one and two dimensional optical gratings
• For wafers from 2 –150 mm (substrates from 2 2 to 6 6 )
• Pieces down to a few millimeters