Die Bonding
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The Next Generation High Speed Die Bonder
The Esec 2100 hS is a highly scalable High Speed Die Bonder providing the best possible Cost of Ownership (CoO).
Key Features:
• Leading Edge Machine Concept
• Highest Up Time
• Highest Speed at 20 µm Accuracy
• Fastest time to Yield
• The Platform of the Future
The Esec 2100 hS is a highly scalable High Speed Die Bonder providing the best possible Cost of Ownership (CoO).
Key Features:
• Leading Edge Machine Concept
• Highest Up Time
• Highest Speed at 20 µm Accuracy
• Fastest time to Yield
• The Platform of the Future
Esec 2100 hS
Model No.: Esec-2100-hS
Product Details:
Specifications:
• Bonding method : Epoxy
• Cycle time : 120 ms with Liquid Cooling option
• Bonding accuracy : 20 µm @ 3σ (15 µm option)
• Wafer size : 4" to 12" (on 8" or 12" wafer frames)
• Die size : 0.25 mm (with Small Die Kit) to 20 mm
• Leadframe size Length: 90 to 300 mm, Width: 23 to 100 mm
• Bonding method : Epoxy
• Cycle time : 120 ms with Liquid Cooling option
• Bonding accuracy : 20 µm @ 3σ (15 µm option)
• Wafer size : 4" to 12" (on 8" or 12" wafer frames)
• Die size : 0.25 mm (with Small Die Kit) to 20 mm
• Leadframe size Length: 90 to 300 mm, Width: 23 to 100 mm
